| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and apparatus for drying a cleaned object, so as to suitably clean, rinse and dry substrates such as a semiconductor wafer and a glass substrate. SOLUTION: The method includes steps of etching processing over an object 50 to be cleaned by transferring of the object 50 by a transfer means to a support base 28 and into a pure water bath 20 which does not have a chemical supplied there into, supplying a chemical into the pure water bath 20 and immersing the object 50 in the chemical; rinsing over the object by supplying pure water into the bath 20, after the completion of etching operation and gradually replacing the chemical by pure water; rinsing the object 50 with use of reducing addition pure water in place of pure ware, after completion of the rinsing operation; supplying mist of an organic solvent from a nozzle 26 under the condition that the object 50 be immersed in the pure water placed in the bath 20 and also forming a sufficient thickness of layer of the organic solvent mist on a liquid surface of the pure water; and vaporizing and drying the organic solvent, after the reducing addition pure water on the surface of the object 50 is replaced by the organic solvent of the mist layer and supplying and inactive gas from a nitrogen gas supply port 24.
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