发明名称 WET ETCH APPARATUS FOR FABRICATING SEMICONDUCTOR WAFER
摘要 PURPOSE: A wet etch apparatus for fabricating a semiconductor wafer is provided to remove a loss of a pump by forming an absorbing body and an absorbing fixing guide with one body. CONSTITUTION: A wet etch apparatus(10) is formed with a chemical tank(20), a supply tube(30), a supplement tube(40), a pump(100), and a chemical vessel(50). The chemical tank(20) is used for storing chemicals supplied from a chemical supply room. The supply tube(30) is used for connecting the chemical tank(20) with the chemical vessel(50). The chemicals of the chemical tank(20) are supplied to the chemical vessel(50) through the supply tube(30) according to a programmed time schedule of a control device. The pump(100) is located on a path of the supplement tube(40) in order to supplement the chemicals into the chemical vessel(50) and control density of the chemical vessel(50).
申请公布号 KR20030003552(A) 申请公布日期 2003.01.10
申请号 KR20010039458 申请日期 2001.07.03
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE, HEON U
分类号 H01L21/3063;(IPC1-7):H01L21/306 主分类号 H01L21/3063
代理机构 代理人
主权项
地址