| 摘要 |
PROBLEM TO BE SOLVED: To suppress a package from breaking in the event of wafer warpage. SOLUTION: The method comprises (step S10) forming of trenches into later dividing positions of a cover wafer, (step S12) bonding an SAW wafer, having an SAW device to the cover wafer, and dividing the two wafers having bonded along dicing lines. The trenches, formed at the dividing positions into the cover wafer, make the cover wafer easy to break along the trenches, i.e., the dividing positions, when the wafer becomes warped. As a result, if the two bonded wafers warp in the step S12, etc., the cover wafer will break along the dividing positions and the breaking hardly propagates to package forming regions, thereby suppressing the package from breaking. |
