| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition whose glass transition temperature, is high and whose moisture-resistant insulation reliability is superior, to provide a multilayer printed wiring board which uses the photosensitive resin composition, a method of manufacturing a buildup multilayer wiring board. SOLUTION: The photosensitive resin composition, which forms a photosensitive insulating layer on an insulating board for the buildup multilayer wiring board, is a photosensitive resin composition which contains (a) a polyfunctional epoxy resin, (b) a resin comprising a phenolic hydroxyl group, (c) a photooxidation generator, and (d) an inorganic ion exchanger. The multilayer printed-wiring board uses the photosensitive resin composition, and the method of manufacturing the buildup multilayer wiring board. |
