发明名称 SUBSTRATE PROCESSING UNIT
摘要 PROBLEM TO BE SOLVED: To cut processing liquid supplied to a substrate being processed on a carrying path laid in the horizontal direction from the substrate efficiently in a short time. SOLUTION: When a substrate G reaches a specified position on a carrying path 108, rotation of a carrying roller 138 is interrupted to stop the substrate G. A drive section 188 is operated immediately thereafter to elevate an elevating/lowering shaft 186. Consequently, a base plate 182 and a lift pin 184 are raised too, and the substrate G is pushed up by the lift pin 184 above the carrying path 108. Subsequently, the base plate 182 is turned rearward at a specified angle about a shaft 196 extending in the widthwise direction of the carrying path 108. Consequently, a lift pin 192, a stopper member 194, and the substrate G incline rearward by the same angle on the carrying path 108. The substrate G is received by the stopper member 194 and liquid Q on the substrate G slips gravitationally rearward on the inclining face of the substrate and drops to the outside of the substrate. The liquid Q dropped from the substrate G is received in a pan 130.
申请公布号 JP2003007582(A) 申请公布日期 2003.01.10
申请号 JP20010184717 申请日期 2001.06.19
申请人 TOKYO ELECTRON LTD 发明人 TATEYAMA KIYOHISA;MOTODA KIMIO
分类号 G02F1/13;B65G49/06;G03F7/30;H01L21/027;H01L21/677;H01L21/68;(IPC1-7):H01L21/027 主分类号 G02F1/13
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