| 摘要 |
PROBLEM TO BE SOLVED: To provide a film-forming processor, capable of forming desired unformed film portions and uniformizing the influence of a clamp ring on a work for forming a uniform film. SOLUTION: The clamp ring 24 has a contact part 124, having random micro- irregularities formed by, e.g. blasting a part which faces the outermost peripheral part of a semiconductor wafer 1 on the downside of the ring body 126. The contact part 124 expands over the entire peripheral zone of a width d1, at a distance d2 from the inside edge of the ring body 126; the distance d2 may, e.g. be about 1-3 mm and the width d1 may, e.g. be about 1 mm. The ring body 126 faces the wafer 1 with a constant distance Rmax of, e.g. 1.6μm or less, in parts other than the contact part 124.
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