| 摘要 |
<p>PROBLEM TO BE SOLVED: To solve the problem in the prior art that, when a semiconductor package having a side electrode is jointed to a mounting with solder, the solder fillet has an optimul shape in its mountain root, but miniaturization of the package involves unsecured reliability of the shape. SOLUTION: The height (ra) and width (wa) of a package side electrode, and the length (rb) and width (wb) of a mounting part electrode are set to have dimensional mutual relations of ra/rb=0.7 to 1.3 and wa<=wb; and the amount (V) of solder fillet is set to satisfy a relation of (ra×rb×wa÷2)+ ra×rb(wb-wa)÷6<V<π×ra×wa÷4+π×ra×rb(wb-wa)÷12.</p> |
