发明名称 |
APPARATUS FOR TRANSFERRING SEMICONDUCTOR WAFER |
摘要 |
PURPOSE: An apparatus for transferring a semiconductor wafer is provided to transfer stably a wafer and prevent a damage of the wafer by changing an incline of a robot chuck according to an incline state of the wafer. CONSTITUTION: A robot is elevated and rotated according to a control signal. A robot arm(20) is installed at the robot. The robot arm(20) is moved to a horizontal direction according to the control signal. A robot chuck(12) is installed at an end portion of the robot arm(20). The robot chuck(12) is closely contacted with a bottom face of a wafer(W) by operations of the robot and the robot arm(20). An angle control portion(24) is installed to control an angle of the robot chuck(12) according to an angle control signal. A transfer portion is formed with the robot, the robot arm(20), and the angle control portion(24). The transfer portion is controlled by a controller.
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申请公布号 |
KR20030003518(A) |
申请公布日期 |
2003.01.10 |
申请号 |
KR20010039414 |
申请日期 |
2001.07.03 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE, GYEONG BAE |
分类号 |
H01L21/68;(IPC1-7):H01L21/68 |
主分类号 |
H01L21/68 |
代理机构 |
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代理人 |
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地址 |
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