BAKE APPARATUS FOR FABRICATING SEMICONDUCTOR DEVICE

摘要

PURPOSE: A bake apparatus for fabricating a semiconductor device is provided to perform a bake process by floating a wafer on a hot plate. CONSTITUTION: A hot plate(110) is installed at a lower side of the inside of a chamber. A heater coil is wound on the hot plate(110). Three through-holes are formed on the hot plate(110) in order to pass through three guide pins(300). A wafer guide(130) is installed around an edge of the hot plate(110) in order to guide a loading position of a wafer(140). An air plate(200) is installed on an upper surface of the hot plate(110). A space portion is formed in the inside of the air plate(200). A plurality of air injection holes(220) are formed on the air plate(200). Three through-holes are formed on the air plate(200). An air bearing and the air plate(200) are formed with one body. An air supply tube(260) is connected with an entrance of the air bearing. A ring-shaped connection member(310) is connected with lower end portions of the guide pins(300).