ELECTRONIC DEVICE AND MANUFACTURING METHOD THERFOR

摘要

PROBLEM TO BE SOLVED: To provide an electronic device of high manufacturing yield. SOLUTION: The manufacturing method for an electronic device comprises a process for preparing on one main surface a wiring board comprising first and second regions different from each other, a first electronic part comprising a plurality of first bump electrodes on one main surface, and a second electronic part comprising a plurality of second bump electrodes whose melting-point is higher than the first bump electrode on one surface. It also comprises a process where the plurality of first bump electrodes are melted so that the first electronic part is mounted in the first region on one main surface of the wiring board; and a process where the second electronic part is mounted in the second region of one main surface of the wiring board by press-fitting the second electronic part under heat, while a bonding resin is interposed between the second region of one main surface of the wiring board and one main surface of the second electronic part. The process for mounting the second electronic part is performed before the process for mounting the first mounting part.