| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface mounting light emitting device which can be made thin easily and its manufacturing method. SOLUTION: The surface mounting light emitting device comprises a package comprising a metal substrate 15 having a through hole 14 in the thickness direction and a thin flat plate 13 bonded to one side of the metal substrate to choke the through hole, and an LED chip 16 mounted on the thin flat plate in the through hole. The thin flat plate 13 is separated by an insulating separating part 24 of an insulating resin 13a into a first thin metal plate and a second thin metal plate. The insulating separating part is located on the bottom face of the through hole and the positive and negative electrodes of the LED chip are disposed oppositely to the first and second thin metal plates 13b and 13c, respectively, and connected therewith. |
