| 摘要 |
PROBLEM TO BE SOLVED: To form a semiconductor chip always, having a uniform thickness in the so-called 'pre-dicing' which forms cutting grooves not reaching the backside into the surface of a semiconductor wafer and grinds the backside to expose the cutting grooves on the surface, thereby dividing it into individual semiconductor chips. SOLUTION: The semiconductor wafer dividing system comprises at least a half cutter for forming cutting grooves which do not reach the backside into the surface of a semiconductor wafer; a grinder for grinding the backside of the wafer having the cutting grooves to expose the cutting grooves on the surface, thereby dividing it into individual semiconductor chips; a grinding controller for controlling the grinding feed rate of the grinder; and a tape changer for pasting a support tape to the backside of the semiconductor chip and peeling off a protective tape, pasted on the surface and a thickness measuring unit for measuring the thickness of the semiconductor chip. The grinder controller controls the grinding feed rate of the grinder, based on the measured value or the semiconductor chip thickness by the thickness-measuring unit, so that a semiconductor chip will always have a constant thickness can always be produced, without being influenced by wear of the grindstone, even when there is any. |
