| 摘要 |
PROBLEM TO BE SOLVED: To overcome such a problem that multiplayer wiring structure cannot be formed and that the warpage of an insulating resin sheet in a manufacturing process is remarkable in a semiconductor device where a flexible sheet having a conductive pattern is adopted as a support substrate, a semiconductor element is mounted on the substrate and a whole part is molded. SOLUTION: The insulating resin sheet 1 coated with an insulating resin 2 is used for one face of a conductive film 3, and a conductive plating film 4 is formed after a through hole 21 is formed in the insulating resin 2. Thus, multiplayer wiring structure is realized by a first conductive wiring layer 5 formed by etching the conductive plating film 4, and a multilayer-connected second conductive wiring layer 6. The semiconductor element 7 is fixed onto overcoat resin 8 covering the first conductive wiring layer 5. Thus, the first conductive wiring layer 5 becomes a fine pattern and it can freely be routed. Since the second conductive film 4 formed thick is etched to be thin after molding, the second conductive wiring layer 6 can be made into the fine pattern. |
