| 摘要 |
PROBLEM TO BE SOLVED: To realize a flip chip mounting method of a semiconductor device wherein a gold bump is formed on an IC electrode at a low cost and subjected to ultrasonic connection to a wiring board electrode with high reliability. SOLUTION: In a method for mounting an element forming surface of an IC chip on a substrate by face down, a gold bump on the surface of which unevenness is formed is formed by electroplating, as an electrode of the IC chip. The chip is bonded to the wiring board electrode by using ultrasonic wave. |
