ELECTRONIC COMPONENT AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide an electronic component that can be improved in Q-value in a high frequency band and can be reduced in loss in the high frequency band. SOLUTION: A plated metallic film 21 is formed on a dielectric body 1 and the residual stress S of the film 21 satisfies the relation -33.4 kg/mm<2> <=S<=33.4 kg/mm<2> .