| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a wiring board which comprises a buildup layer only on the surface of a core board and in which warp ages are not generated or which is hard to warp. SOLUTION: The wiring board 1 comprises the core board 2, which comprises the surface 4 and the back 5 and which contains an inorganic fiber, through-hole conductors 6 which are passed between the surface 4 and the back 5 at the core board 2, a core wiring layer 8 and a core wiring layer 9 which are formed on the surface 4 and the back 5 at the core board 2 and which are set with continuity to the conductors 6, a buildup wiring layer 14 and a buildup wiring layer 20 which are formed in the upper part of the surface 4 at the core board 2 and which are set to continuity to the conductors 6, a buildup insulation layer 10 and a buildup wiring layer 16 which are formed between the core board 2 and the layer 14 and between the layer 14 and the layer 20, and a back-side insulation layer 11 which is formed on the back 5 (the lower side in the figure) at the core board 2 directly on via the layer 9 on the back side and which contains inorganic fiber.</p> |
