发明名称 IMAGE PICKUP DEVICE MODULE HAVING PRESSURE CONTACT CONNECTOR
摘要 <p>PROBLEM TO BE SOLVED: To provide a miniaturized imaging module easy to assemble or disassemble. SOLUTION: The module is provided with a pressure connector 106 comprising a connector body 107 wherein a contact 101a is formed on an imaging substrate 101 equipped with an image pickup device 102 and a contact 105a is formed on a circuit board 105 as well as both a terminal 107a elastically touch the contact 101a on the substrate 101 and a terminal 107b elastically touch the contact 105a on the substrate 105 are provided, and a positioning member 108. In this configuration, the imaging substrate 101 is connected with the circuit board 105 with the pressure connector through the positioning member so that their contacts are elastically touch the terminal of the connector body.</p>
申请公布号 JP2003007373(A) 申请公布日期 2003.01.10
申请号 JP20010192185 申请日期 2001.06.26
申请人 TOSHIBA CORP 发明人 AOKI SHIN;SASAKI SATOYUKI
分类号 H01L27/14;H01L23/32;(IPC1-7):H01R12/16;H04N5/335 主分类号 H01L27/14
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