| 摘要 |
<p>PROBLEM TO BE SOLVED: To raise the cooling effect of a semiconductor device, and also to achieve miniaturization and reduction of weight. SOLUTION: The semiconductor device comprises a resin package 2 formed on a first main surface 1a side, of a substrate 1 of silicon, etc., with an element formed with the resin package 2 provided with a bump 3 of an external connection terminal. On the side of second main surface 1b, of the substrate 1, with no element formed, protruded/recessed parts 11 is formed together with the substrate 1 as one body, with the protruded/recessed parts 11 provided with rough parts 12.</p> |
