| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a low heat-resistance semiconductor device which can efficiently radiate heat by using a terminal for signal or power source without arranging a terminal for heat radiation. SOLUTION: A semiconductor chip 2 is loaded on the chip loading face 1b of a package substrate 1. In a face on the opposite side of the chip loading face 1b, a plurality of outer connection terminals 6 are arranged in the peripheral area of the semiconductor chip 2. A plurality of conductor patterns 10 which extend in an area where the semiconductor chip 2 is loaded and are electrically separated are arranged. The conductor patterns 10 are connected only to one of the outer connection terminals 6.</p> |
