| 摘要 |
PROBLEM TO BE SOLVED: To provide a dicing adhesive sheet for fixing various kinds of works to be cut by dicing, such as semiconductor components which prevents chipping in dicing and a method of manufacturing cut products of various kinds of works, such as semiconductor components by dicing with use of the dicing adhesive sheet. SOLUTION: The adhesive sheet comprises a viscoelastic layer (A), hardened on at least one side of a base film by an energy beam incident on the base film and an adhesive layer (B), laminated on the viscoelastic layer (A). |
