| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem of reliability in air-tight sealing which is induced, as the vessel for housing an electronic component becomes smaller and thinner, related to the vessel for housing an electronic component composed of a plate- like lid which houses air-tightly, using a glass sealing material, an electronic component in the space before an insulating base board. SOLUTION: The vessel for housing an electronic component comprises an insulating base body 1 provided with, on its upper part, a recessed part in which an electronic component 3 is mounted, and a lid 2 which is jointed to the upper surface of insulating base body 1 through a glass sealing material 6 to house the electronic component 3 in air-tight manner in the space before the insulating base body 1. The lid 2 is composed of a flat plate of 0.3 mm or less in thickness. The outside dimension of it is less than the insulating base body 1 by 0.1-0.3 mm, while the outer sides of it are positioned inside the outer sides of the insulating base body 1 across the entire periphery of it by 0.02-0.3 mm.
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