| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing apparatus and method which can collect a substrate, without damaging the surface of the substrate. SOLUTION: A cleaning system 1 includes wafer transfer devices 13 and 15, a sensor for detecting wafer present within the system 1, a memory 74 for storing information on the wafer present within the system 1 at turning off of the power of the system 1, a device controller 71 for controlling the transfer devices 13 and 15 to collect the wafer present within the system 1 outside of the system, and a collection starter 77 for issuing a command to the device controller 71 to cause the devices 13 and 15 to start the collection of the wafer. Information, detected by the wafer detection sensor at the time of starting the power turning on of the system 1 is collated with wafer information extracted from the memory 74, and after it is confirmed that the wafer within the system 1 is collected with their being set to face a predetermined direction, a collection command has been issued from the collection starter 77 to the device controller 71. |
