| 发明名称 |
Mold |
| 摘要 |
A mold has two mold halves (6, 7). One of the mold halves (6) includes a contact section (8) which is adapted to contact a surface (5) of a semiconductor chip (1) mounted in the mold, in use. |
| 申请公布号 |
US2003006529(A1) |
申请公布日期 |
2003.01.09 |
| 申请号 |
US20010901517 |
申请日期 |
2001.07.09 |
| 申请人 |
ASM TECHNOLOGY SINGAPORE PTE LTD |
发明人 |
HO SHU CHUEN;KUAH TENG HOCK;HUI MAN HO;NARASIMALU SRIKANTH;SARANGAPANI MURALI |
| 分类号 |
H01L21/56;(IPC1-7):B29C70/72 |
主分类号 |
H01L21/56 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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