| 摘要 |
<p>A curable epoxy resin composition which comprises (A) a crystalline epoxy resin, (B) a phenolic resin, and (C) a silicone resin represented by an average rational formula and having epoxidized organic groups and phenyl groups {the amount of the silicone resin is 0.1 to 500 parts by weight per 100 parts by weight of the sum of the ingredients (A) and (B)}. This composition has satisfactory moldability and gives a cured article having excellent flame retardancy. It does not adversely influence the human body or the environment because it contains neither a halogenated epoxy resin nor an antimony oxide compound.</p> |
