发明名称 CURABLE EPOXY RESIN COMPOSITION
摘要 A curable epoxy resin composition which comprises (A) a crystalline epoxy resin, (B) a phenolic resin, and (C) a silicone resin represented by an average rational formula and having epoxidized organic groups and phenyl groups {the amount of the silicone resin is 0.1 to 500 parts by weight per 1 00 parts by weight of the sum of the ingredients (A) and (B)}. This composition has satisfactory moldability and gives a cured article having excellent flam e retardancy. It does not adversely influence the human body or the environmen t because it contains neither a halogenated epoxy resin nor an antimony oxide compound.
申请公布号 CA2452398(A1) 申请公布日期 2003.01.09
申请号 CA20022452398 申请日期 2002.06.28
申请人 DOW CORNING TORAY SILICONE CO., LTD. 发明人 NAKANISHI, KOJI;FURUKAWA, HARUHIKO;MORITA, YOSHITSUGU;UEKI, HIROSHI
分类号 C08K3/00;C08G59/20;C08G59/62;C08L61/04;C08L61/06;C08L63/00;C08L83/04;C08L83/06;(IPC1-7):C08L63/00 主分类号 C08K3/00
代理机构 代理人
主权项
地址