发明名称 |
CURABLE EPOXY RESIN COMPOSITION |
摘要 |
A curable epoxy resin composition which comprises (A) a crystalline epoxy resin, (B) a phenolic resin, and (C) a silicone resin represented by an average rational formula and having epoxidized organic groups and phenyl groups {the amount of the silicone resin is 0.1 to 500 parts by weight per 1 00 parts by weight of the sum of the ingredients (A) and (B)}. This composition has satisfactory moldability and gives a cured article having excellent flam e retardancy. It does not adversely influence the human body or the environmen t because it contains neither a halogenated epoxy resin nor an antimony oxide compound. |
申请公布号 |
CA2452398(A1) |
申请公布日期 |
2003.01.09 |
申请号 |
CA20022452398 |
申请日期 |
2002.06.28 |
申请人 |
DOW CORNING TORAY SILICONE CO., LTD. |
发明人 |
NAKANISHI, KOJI;FURUKAWA, HARUHIKO;MORITA, YOSHITSUGU;UEKI, HIROSHI |
分类号 |
C08K3/00;C08G59/20;C08G59/62;C08L61/04;C08L61/06;C08L63/00;C08L83/04;C08L83/06;(IPC1-7):C08L63/00 |
主分类号 |
C08K3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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