Manufacturing electronic components, especially chips, involves separating components from wafer, arranging in raster at larger separations, filling spaces, wafer-level packaging

摘要

The method involves producing a number of separate components, especially chips, from a wafer, separating the components, arranging at least some in a raster at larger separations than on the wafer, filling the spaces to form a mounting frame, carrying out wafer-level packaging by making individual component connections and contact elements and/or holding elements near the holding frame and separating the components by dividing the frame. AN Independent claim is also included for the following: an electronic chip manufactured in accordance with the inventive method.