TEST HANDLER APPARATUS FOR SMD, BGA, AND CSP

摘要

PURPOSE: A test handler apparatus for SMD(Surface Mounting Device), BGA(Ball Grid Array) and CSP(Chip Scale Package) is provided to be capable of containing multiple strip packages for the purpose of testing. CONSTITUTION: A test handler apparatus comprises a treatment area, a testing station and an output unit connected to an output of the treatment area. An input unit picks stripped packages and unloads them on carrier boats in a loading zone. A conveyor mechanism transfers the carrier boats from the loading zone through the treatment area to the testing station and from the testing station to the output unit. The carrier boat forms a universal carrier which is able to contain multiple strip packages for the purpose of testing. Placing packages onto carriers with standardized dimension allows handler equipment to accommodate the packages in strip condition.