| 摘要 |
PURPOSE: A method for manufacturing a cooler having heat-pipe-sink for chip module of electronic equipment is provided to simplify a process for heat-pipe-sink by fabricating the first and second blocks through a die casting method wherein the first block functions as a heat absorbing portion of the heat sink and the heat pipe and the second block functions as a heat radiating portion of the heat sink and the heat pipe. CONSTITUTION: The first block is fabricated which has the first space in which the heat absorbing portion of the heat pipe can be formed(S10). The second block is fabricated which has the second space in which the heat radiating portion of the heat pipe connected to the heat absorbing portion can be formed(S20), including a hole through which the inside and outside of the second space can be communicated. A plurality of heat radiating pins protrude to the outside of the second space. The first and second blocks are welded together so that the first and second spaces can be interconnected(S30). The inside of the heat pipe becomes vacuum through the hole(S50). A functioning fluid is injected into the heat pipe through the hole(S60). The hole is sealed up(S70).
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