发明名称 |
Semiconductor device, method of manufacturing semiconductor device, lead frame, method of manufacturing lead frame, and method of manufacturing semiconductor device with lead frame |
摘要 |
The present invention relates to a leadless surface-mount resin-sealing semiconductor device and a manufacturing method thereof; in a semiconductor device comprising a semiconductor element, a resin package sealing this semiconductor element, a terminal formed on a mount side of this resin package so as to protrude thereon, and a wire electrically connecting this terminal and an electrode pad on the semiconductor element to each other, a heat sink dissipating heat generated in the semiconductor element is provided on an undersurface of the semiconductor element so as to improve a heat-dissipation property.
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申请公布号 |
US2003006501(A1) |
申请公布日期 |
2003.01.09 |
申请号 |
US20020226319 |
申请日期 |
2002.08.23 |
申请人 |
FUJITSU LIMITED |
发明人 |
WAKI MASAKI;FUJISAKI FUMITOSHI;TAKEHIRO MASAO;MAKI SHINICHIRO |
分类号 |
H01L21/56;H01L21/68;H01L23/31;H01L23/433;(IPC1-7):H01L23/34 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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