Verfahren zum Verbinden von Kollektorplatten mit den Enden von plattenförmigen Elektroden

摘要

Positive electrode plates (1a) and negative electrode plates (2a) are arranged alternately with intervening separators (3), and their end faces are respectively butted on collector plates (4). A solder material (5) made from nickel alloy is disposed on the surfaces of the collector plates, which are made from nickel. An electron beam (6) is irradiated onto the collector plates for causing the solder material to melt, thereby bonding the end faces of the positive and negative electrode plates with the collector plates.