| 摘要 |
PURPOSE: A carrier apparatus of a semiconductor chip molding press is provided to increase the productivity by automating the working process and to promote the convenience of a worker. CONSTITUTION: A carrier apparatus of a semiconductor chip molding press comprises a plate(350), an air-cylinder(310) and a guide rod(320). The plate(350) includes a space(330) in which a lead frame loaded from magazine(220) is secured, and a space in which a molding product is secured between an upper and a lower molds(110 and 120). The air-cylinder(310) is established on a bottom face of the plate in longitude direction, and moves the plate in back and forth. The guide rod(320) is established in same longitude direction as the air-cylinder, and guides the plate in operation.
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