发明名称 |
System and method of laser sintering dies and dies sintered by laser sintering |
摘要 |
A laser sintering system is provided for sintering a die having a serrate edge. The laser sintering system comprises a laser generator for generating a laser beam and a movable carriage for carrying said die. The laser beam sinters the serrate edge of said die into a smooth edge. A method of sintering a die, the die having a serrate edge, comprises the following steps of providing a die and using a laser beam sintering the serrate edge of said die into a smooth edge. A die has a smooth edge sintered by a laser beam.
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申请公布号 |
US2003008529(A1) |
申请公布日期 |
2003.01.09 |
申请号 |
US20020103971 |
申请日期 |
2002.03.25 |
申请人 |
CHIPBOND TECHNOLOGY CORPORATION |
发明人 |
HWAN LU-CHEN;YIU DANG-CHENG |
分类号 |
B23K26/00;B32B1/00;H01L21/00;H01L21/301;H01L21/324;H01L21/44;H01L21/66;H01L21/78;(IPC1-7):H01L21/66 |
主分类号 |
B23K26/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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