发明名称 System and method of laser sintering dies and dies sintered by laser sintering
摘要 A laser sintering system is provided for sintering a die having a serrate edge. The laser sintering system comprises a laser generator for generating a laser beam and a movable carriage for carrying said die. The laser beam sinters the serrate edge of said die into a smooth edge. A method of sintering a die, the die having a serrate edge, comprises the following steps of providing a die and using a laser beam sintering the serrate edge of said die into a smooth edge. A die has a smooth edge sintered by a laser beam.
申请公布号 US2003008529(A1) 申请公布日期 2003.01.09
申请号 US20020103971 申请日期 2002.03.25
申请人 CHIPBOND TECHNOLOGY CORPORATION 发明人 HWAN LU-CHEN;YIU DANG-CHENG
分类号 B23K26/00;B32B1/00;H01L21/00;H01L21/301;H01L21/324;H01L21/44;H01L21/66;H01L21/78;(IPC1-7):H01L21/66 主分类号 B23K26/00
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