| 摘要 |
<p>A multistep process (28) for dicing of, or drilling of vias in, workpieces (12), such as wafers, that support one or more layers (24) facilitates the optimization of laser or nonlaser processes (28) for each layer (24), including the substrate (26), to improve quality and throughput while reducing adverse affects to the other layers (24). An exemplary process employs a UV laser (14) for cutting through layers (24) that are transparent to IR or visible wavelengths and a different laser (14) or cutting blade for dicing the substrate (26) to minimize damage to the layers (24). A multistep processing technique can be used to mitigate or repair damage that occurs during dicing or drilling processes, to improve the lifetime of the mechanical saw, or to facilitate singulation of the greatest number of undammaged dies from a workpiece (12).</p> |
