Production of a semiconductor component used in the production of a diode, especially a varactor comprises applying a support wafer to a substrate, removing a layer, applying a further support wafer, and removing the first support wafer

摘要

Production of a semiconductor component comprises preparing a semiconductor wafer (100) having a front side (101) and a rear side (102); applying a first support wafer adhering to the front side on the wafer; removing a layer from the semiconductor wafer; applying a second support wafer adhering to the rear side of the removed layer; and removing the first support wafer. Preferred Features: Contacts are produced after removing the first support wafer. The semiconductor wafer is made from silicon carbide. The front side of the semiconductor wafer is structured before applying the first support wafer to define individual component regions.