| 摘要 |
<p>A multi-layer printed circuit board (30) includes a non-conductive via (54) which intersects a conductive trace (44) on an inner layer (38) of the board and is adapted to receive a conductive element (60) configured to make direct contact with the conductive trace (44). The non-conductive via (54) may extend through all or only a portion of the multi-layer board (30). Illustrative conductive elements (60) include a press fit contact, such as an eye-of-the-needle contact of an electrical component, a wedge-shaped contact, and a conductive polymer stripe. Also described is a stepped non-conductive via (160) having a reduced diameter portion (160a) intersecting an inner layer conductor (162) and a larger diameter portion (160b). The stepped via is adapted to receive a conductive element (166) having a reduced diameter portion (166a) in contact with the conductor and a larger diameter portion (166b) press-fit into the larger diameter (160b) portion to mechanically secure the conductive element (166) to the board.</p> |
