| 摘要 |
<p>The wafer clamping mechanism comprises a linkage mechanism and a wafer contact point coupled to the linkage mechanism. The linkage mechanism includes a four-bar linkage having: a first link having a first fixed pivot and a first floating pivot remote from the first fixed pivot; a second link having a second fixed pivot and a second floating pivot remote from the second fixed pivot; and a third link having a first coupling pivot rotatably coupled to the first floating pivot, and having a second coupling pivot rotatably coupled to the second floating pivot. In use motion of the linkage mechanism causes the wafer contact point to clamp a wafer.</p> |
