Anti-stiction method and apparatus for drying wafer using centrifugal force

摘要

An anti-stiction method and apparatus for drying a wafer using a centrifugal force is provided. The anti-stiction method includes the steps of (a) removing a sacrificial layer stacked between the wafer and the micro structure, using an etching solution, (b) rinsing the etched micro structure and the etched wafer in a rinse solution for a predetermined time so that the etching solution between the micro structure and the wafer is replaced with the rinse solution, and (c) mounting the rinsed wafer in a mounting unit connected to a rotation axis and eliminating the rinse solution left between the wafer and the micro structure by the rotation of the axis. The wafer is mounted in the mounting unit in a vertical position so that the micro structure faces outwards from the rotation axis. Accordingly, a stiction phenomenon between the micro structure manufactured by a MEMS process and the wafer in a drying process can be prevented.