发明名称 |
Method of laminating copper foil onto a printed circuit board |
摘要 |
A method of laminating copper foil onto a substrate of a printed circuit board, wherein the substrate has an upper surface and a lower surface. Isolating material is coated onto both surfaces of the substrate to form isolating layers on the substrate. The isolating layers can be formed by roll coating, spray coating or screen printing. The thickness of the isolating layers can be controlled in accordance to the requirements of the circuits. Various types of metal foils can be laminated onto the adhesive layers, followed by heating and pressurization processes to secure the metal foil onto the substrate.
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申请公布号 |
US2003006007(A1) |
申请公布日期 |
2003.01.09 |
申请号 |
US20010901500 |
申请日期 |
2001.07.03 |
申请人 |
LIN CHIA-PIN;FAN CHIH-PENG;HUNG CHANG-YUN;LEE SHENG-CHOU |
发明人 |
LIN CHIA-PIN;FAN CHIH-PENG;HUNG CHANG-YUN;LEE SHENG-CHOU |
分类号 |
B32B15/04;B32B15/20;H05K3/38;(IPC1-7):B32B31/20 |
主分类号 |
B32B15/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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