发明名称 BINDER RESIN SOLUTION COMPOSITION, COATINGS, INKS, ADHESIVES AND PRIMERS
摘要 <p>A binder resin solution composition which comprises (a) a chlorinated polyolefin obtained by chlorinating an ethylene /propylene/butene random terpolymer having an ethylene content of 3.0 to 3.7 mole %, a 1-butene content of 2.4 to 2.8 mole %, and a melting point ranging from 129 to 133 ºC to a chlorine content of 10 to 40 wt% and (b) an organic solvent and has a solid content of 10 to 50 wt%; and coatings, inks, and adhesives, containing the composition as the essential component.</p>
申请公布号 WO2003002658(P1) 申请公布日期 2003.01.09
申请号 JP2002006377 申请日期 2002.06.26
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