发明名称 |
Hochspannungsmodul und Verfahren zu dessen Herstellung |
摘要 |
The invention relates to a high-voltage module comprising a housing (9) which accommodates at least one structural component (4, 5) that is fastened on a metal-ceramics substrate from a ceramic layer (1) comprising a first main face (11) and a second main face (12) opposite said first main face (11), an upper metal layer (15) on the first main face (11) and a lower metal layer (16) on the second main face (12). The high-voltage module is further characterized by comprising on the outer edges (14) of the substrate either a cast from weakly conductive particles (17) and a gel, or a cast from particles having a high dielectric constant as compared to the cast gel (17), and a gel. |
申请公布号 |
DE10130517(A1) |
申请公布日期 |
2003.01.09 |
申请号 |
DE2001130517 |
申请日期 |
2001.06.25 |
申请人 |
EUPEC GMBH & CO. KG |
发明人 |
BAYERER, REINHOLD;GABLER, VOLKER;LICHT, THOMAS |
分类号 |
H01L23/24;H01L23/29;H05K1/02;H05K1/03;H05K3/28 |
主分类号 |
H01L23/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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