| 摘要 |
PURPOSE: A cleaning apparatus and a cleaning method using the same are provided to prevent damage of contact holes due to cleaning solutions and improve yield by using dry cleaning without using the cleaning solutions. CONSTITUTION: The cleaning apparatus comprises a cooling unit(1) and an accelerated nozzle(2). Cleaning gases are changed to vapor state by using the cooling unit(1). The cleaning gases of the vapor state from supplying the cooling unit(2) are accelerated and sprayed on the surface of a wafer(3) by using the accelerated nozzle(2). N2 is used as the cleaning gas.
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