| 摘要 |
A micro tool set is described in which all of the tools are formed from stock no larger than 1.0 mm in diameter. Each tool is laser machined from stock no larger than 1.0 micron in diameter. Various shapes are "carved" from the original stock such that the finished tool does not extend beyond the nominal cylindrical shape of the stock. The tools are specifically adapted to be used for the repair of semiconductor test probe head wires.
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