| 摘要 |
The invention relates to the laser adjustment or laser programming of laser fuses of an integrated circuit (2) on a chip (1), with laser light (7), the integrated circuit (2) having a plurality of laser fuses (3) and being connected to a plurality of contact pads (4) on the chip (1), and the chip (1) being covered with a polymer layer (5) which has at least windows (16) on the plurality of contact pads, and comprising at least one wiring interconnect (9) on the polymer layer (5) which is electrically connected to at least one of the plurality of contact pads (4) and ends at a predetermined location on a surface of the chip (1). To make it possible for integrated circuits to be programmed with laser light as late as possible in the production process, according to the invention the chip (1) is irradiated in a predetermined region with intensive laser light (7), so that in the wiring interconnect (9) there is created an interconnect opening (14), in the polymer layer (5) lying thereunder there is created a layer opening (15) and at least one of the plurality of laser fuses (3) is interrupted in the predetermined region.
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