发明名称 Structure and method for fabricating semiconductor structures with integrated thermo-electric devices
摘要 High quality epitaxial layers of monocrystalline materials can be grown overlying monocrystalline substrates such as large silicon wafers by forming a compliant substrate for growing the monocrystalline layers. An accommodating buffer layer comprises a layer of monocrystalline oxide spaced apart from a silicon wafer by an amorphous interface layer of silicon oxide. In addition, formation of a compliant substrate may include utilizing surfactant enhanced epitaxy, epitaxial growth of single crystal silicon onto single crystal oxide, and epitaxial growth of Zintl phase materials. A thermo-electric device is integrated into the semiconductor structure.
申请公布号 US2003006470(A1) 申请公布日期 2003.01.09
申请号 US20010897968 申请日期 2001.07.05
申请人 MOTOROLA, INC. 发明人 FRANSON STEVEN JAMES;MARSHALL DANIEL S.;HOLM PAIGE M.;HOLMES JOHN E.;BOSCO BRUCE ALLEN;EMRICK RUDY M.
分类号 H01L31/058;(IPC1-7):H01L31/058 主分类号 H01L31/058
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