| 摘要 |
<p>A method of predicting processed results, capable of simply and accurately predicting processed results by using a small number of operation data and processed result data obtained by processing a small number of samples by a plasma processing device, and a processing device. The device comprises an operation data storing means (51) for storing operation data such as various temperatures (T1, T2, T3) and a back-side gas pressure P gathered in the step of processing a plurality of wafers (W) one by one in a processing chamber of the plasma processing device, a processed result data storing means (52) for storing processed result data such as in-plane uniformity after wafer (W) etching, a multivariable analyzing unit (54) for performing a multivariable analysis, and a multivariable analysis storing unit (55) for storing prediction expressions obtained as a result of the multivariable analysis, wherein the multivariable analyzing unit (54) performs a multivariable analysis based on data groups stored in the storing means (51, 52), the correlation between operation data and processed result data is determined via the multivariable analysis, and processed results are predicted using operation data obtained when wafers (W), other than wafers (W) correlated based on this correlation, are processed.</p> |
