HEATING CHAMBER AND METHOD FOR HEATING WAFER USING THE SAME

摘要

PURPOSE: A heating chamber is provided to minimize heat loss inside a predetermined space between a pedestal and a cover by arbitrarily controlling a rise or a fall of the pedestal. CONSTITUTION: The pedestal(44) has a supporting surface(44a) for supporting a wafer, capable of vertically moving between an increased process position and a decreased loading position. The cover(46) has a sidewall(46a) and an upper wall(46b) to define a predetermined space together with the supporting surface when the pedestal is located in the process position, installed over the pedestal. A heating apparatus(142,144) heats the wafer.