LASER BEAM MACHINING DEVICE AND LASER BEAM MACHINING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a laser beam machining device which is capable of stably machining only the desired thin-film material without damaging a thin-film material of a lower layer and facilitates position checking and a laser beam machining method. SOLUTION: In irradiating the film material formed by being laminated on a glass substrate 1 or semiconductor substrate with a laser beam 21 and machining the thin-film material to cut the thin-film material of a portion thereof or connecting the same to the other thin-film material, the focus of the laser beam 21 is deviated from the thin-film material (20) to be machined and in this state the thin-film material is machined by irradiation with the laser beam 21. The front surface end of the material to be machined or the under surface and of the material to be machined is preferably so set as to exist at 1 to 5μm from the focus end of the laser beam.