| 摘要 |
This invention relates to the layer-by-layer assembly of graded semiconducting films by laying nanoparticles on a substrate in a sequence from smaller to larger sizes, which can be done economically and effectively. Layer-by-layer assembly (LBL) enables effective processing of semiconductor, metal, or metal oxide nanoparticle dispersions into functional advanced materials, which retain distinctive optical, magnetic and electrical qualities of size-quantized state of matter. |
