LAMINATE AND MULTILAYERED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a laminate having metal foil/adhesive layer/polyimide film/adhesive constitution having high heat resistance, a narrow pitch wiring pattern, a small diameter via, uniform insulating layer thickness, the properly low coefficient of linear expansion and excellent surface smoothness. SOLUTION: The laminate is constituted by providing a metal foil on one surface of a polymeric film and providing an adhesive layer on the other surface thereof. The polymeric film comprises a polyimide film and the metal foil is a metal foil with a thickness of 5μm or less having a release carrier and the hot flowability of the adhesive layer at the time of lamination processing is 1-100%.