发明名称 |
HIGH RIGIDITY, MULTI-LAYERED, SEMICONDUCTOR PACKAGE AND METHOD OF MAKING THE SAME |
摘要 |
The present invention provide a plurality of layered substrates for semiconductor packages. The substrates include, for example, a metal matrix composite layer and at least one carrier layer having a coefficient of thermal expansion and a thermal conductivity greater than the metal matrix composite. In the preferred embodiment, the metal matrix composite includes between approximately 50% to 95% refractory metal with the remainder copper. Suitable carrier layer materials include, for example, copper. So configured, the layered substrates provide improved rigidity and thermal characteristics for matching with ceramic materials. |
申请公布号 |
EP1273037(A2) |
申请公布日期 |
2003.01.08 |
申请号 |
EP20010923078 |
申请日期 |
2001.04.03 |
申请人 |
BRUSH WELLMAN INC. |
发明人 |
KARKER, JEFFREY, A.;MAX, LEE, B.;SEPULVEDA, JUAN, L.;DALAL, KIRANKUMAR, H.;ADAMS, NORBERT |
分类号 |
C22C29/06;B22F7/06;C22C9/00;C22C14/00;C22C21/00;C22C25/00;C22C27/00;C22C29/12;H01L23/057;H01L23/14;H01L23/367;H01L23/373 |
主分类号 |
C22C29/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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